Diamond wire saw, also known as diamond wire, refers to the use of electroplating process or resin bonding method, the diamond abrasive fixed on metal wire.
In 1990s, in order to solve the problem of large size silicon wafer processing, wire saw technology was used to cut silicon rods into chips. The early wire saw processing technology is using bare metal wire and free abrasive. In the process of processing, the grinding material is added between the third to the metal line and the machining parts. This technology has been successfully applied to the processing of silicon and silicon carbide. In order to further shorten the processing time, and to process other hard and difficult ceramics, the diamond abrasives are fixed to the metal line in a certain way, thus producing a fixed diamond wire saw.