The principle of polishing is mainly reflected in 2 aspects: the principle of particle lapping and the principle of physical chemistry.
1. Particle grinding: When abrasive particles from coarse grinding to fine grinding, polishing, abrasive in the stone surface grinding traces from thick to thin again to the naked eye to see the traces, the surface will appear smooth, smooth, delicate, when the depth of up to 110 microns, is machined surface mirror luster, radiant, bright color.
2. Physical Chemistry principle: polishing process has 2, namely "dry polishing and wet polishing", polishing grindstone between "dry and wet" when stone products take place physicochemical effect, dry polishing is in the stone surface temperature rise to evaporate water, resulting in polishing grinding stone concentration increased, so as to achieve enhanced effect, product gloss began to meet the ideal requirements, gloss of up to 85 degrees or higher.
Polished stone in the processed products polished, to be polished after the hot product, the board surface water, to play a role in cooling, do not allow the continuous addition of water or a large amount of water, otherwise, the water lubrication will make the polishing can not achieve the ideal effect, also can not all use dry polishing, too high temperature will burn the board surface, and will make the plate surface crack.
Generally speaking, after the product is milled, the gloss of the product is $number around, and some of the stone is not polished to the gloss above, such as Shanxi black, black gold sand, Jining black and so on, this kind of product grinding gloss only 20 30 between, in front of the particle grinding principle is not enough to explain the product in the polishing "dry and wet", temperature rise, cooling, strengthen the polishing process, the occurrence of physical and chemical reaction, the product in the "dry polishing, wet polishing", the degree of gloss gradually improved, Gloss of up to 85 degrees